Description:

Effective Signal Transmission: The small size of our BGA Solder Balls allows for efficient transmission of electronic during welding work. This feature makes our solder balls invaluable tools for various soldering applications, ensuring seamless connectivity and reliable signal transmission.. High-Quality Tin Material: Our Tin Solder Ball is made from top-quality tin material, ensuring stability and durability for long-term use. This reliable solder ball will provide consistent and secure connections for your soldering needs, making your work efficient and effective.. Seamless Chip and PCB Connection: Designed specifically for BGA reballing, our Tin Solder Ball is perfect for connecting semiconductor chips, circuit modules, and PCB boards. With these solder balls, you can achieve smooth and reliable connections, ensuring optimal performance and functionality.. Abundant Quantity: We provide a generous supply of our Soldering Heat Universal Stencil Balls. Each bottle contains approximately 12,500 solder balls in different sizes, ensuring that you have more than enough to meet your basic soldering needs. This abundance allows for uninterrupted work and ensures that you never run out of solder balls when you need them most.. Stability and Long Service Life: Our Tin Solder Ball for BGA reballing is designed with a stable structure, ensuring excellent performance and a prolonged service life. With its durability and stability, this solder ball is a reliable tool for industrial soldering applications, making your work efficient and cost-effective.